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Detail Journal

Kemeitai is committed to the research and development, production, and sales of environmentally friendly electronic packaging materials.

Component packaging is primarily categorized into two types: DIP (Dual In-line Package) and SMD (Surface Mount Device). From a structural perspective, packaging technology evolved from the earliest transistor TO packages (e.g., TO-89, TO-92) to Dual In-line Packages; subsequently, seven additional packaging forms were developed:

1.  **SOP/SOIC** — Small Outline Package / Small Outline Integrated Circuit Package

2.  **SOJ** — Small Outline Package with J-shaped Leads

3.  **TSOP** — Thin Small Outline Package

4.  **VSOP** — Very Small Outline Package

5.  **SSOP** — Shrink Small Outline Package

6.  **TSSOP** — Thin Shrink Small Outline Package

7.  **SOT** — Small Outline Transistor (for diodes and transistors)

8.  **DIP** — Dual In-line Package (Dual In-line Component)

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