As the semiconductor packaging and testing industry places increasingly high demands on supply chain localization and precision, the quality of core packaging materials directly impacts chip yield and transport safety. Recently, Kemeitai Anhui New Materials Co., Ltd. (hereinafter referred to as “KMT“) achieved a major technical milestone: its self-developed core cover tape products underwent comprehensive testing at Tianshui Huatian Technology Co., Ltd. (hereinafter referred to as “Huatian Technology”), a leading enterprise in the integrated circuit packaging and testing industry.
Test data indicates that KMT’s cover tape products performed exceptionally stably across core key metrics, most notably peel force. With all performance indicators reaching advanced industry standards, the products successfully passed rigorous production line validation.
Leading in Core Metrics, Overcoming the Industry Pain Point of “Peel Force”
As a critical component of the carrier tape packaging system for electronic components, the primary function of the cover tape is to protect components inside the carrier tape pockets from external contamination and physical damage. In practical applications, the stability of the “peel force” is the most crucial—and hardest to master—metric for evaluating cover tape quality.
If the peel force is too high, automated downstream equipment can cause the carrier tape to shake during peeling, leading to component ejection or damage. Conversely, if the peel force is too low, the cover tape may peel off prematurely, causing components to fall out.
In Huatian Technology’s high-standard testing, KMT’s cover tape products demonstrated outstanding quality:
Excellent Peel Stability: In continuous, long-term peeling tests, the peel force curve remained smooth without sudden spikes or breakage.
Superior Environmental Resistance: The products maintained stable adhesion and peeling performance even after undergoing varying temperature and humidity aging cycles.
Outstanding Anti-Static and High Transparency: The design perfectly balances anti-static protection with the visibility requirements needed for downstream Automated Optical Inspection (AOI).
A Powerful Alliance Accelerating the Localization of Critical Semiconductor Materials
As a world-renowned semiconductor IC packaging and testing enterprise, Huatian Technology is known for its stringent supplier material screening. The stable performance of KMT’s cover tape in Huatian Technology’s line tests not only validates KMT’s deep technical expertise in microelectronic packaging materials, but also signals that its products possess the hard power to compete with top-tier international brands.
Since its establishment, KMT Anhui New Materials has focused on the R&D and production of high-end electronic packaging materials. Relying on advanced coating processes, precise formulation control, and strict quality management systems, the company is dedicated to solving the bottlenecks in semiconductor materials that have long been dominated by foreign suppliers.
Looking Ahead: Deepening Cooperation to Build a Green and Efficient Supply Chain
The successful completion of this test lays a solid foundation for deeper cooperation between KMT and Huatian Technology in the future.
Moving forward, KMT Anhui New Materials will continue to uphold the philosophy of “Quality First, Technological Innovation.” Driven by the actual needs of leading enterprises like Huatian Technology, KMT will continuously optimize product performance and ensure a supply of high-quality, high-stability materials. The two companies will advance hand in hand to promote the high-quality development of China’s semiconductor packaging and testing chain, contributing to a more secure, efficient, and self-controllable industrial ecosystem.
