We are excited to announce that Kemeitai Anhui New Material Co.,Ltd will be showcasing our latest innovations at Electronica China 2026 in Shanghai! As a leading manufacturer specializing in semiconductor packaging cover tapes, we invite you to visit our booth to discover how we ensure the safest transport and seamless feeding for your high-value components.
In the fast-evolving semiconductor industry, precision and reliability are non-negotiable. Our team is ready to demonstrate how our advanced carrier tape and cover tape solutions can optimize your packaging efficiency and protect components from ESD and contamination.
Event Detail
Event: Electronica China 2026
Date: July 1-3 2026
Location: Shanghai New International Expo Centre (SNIEC), China
Our Booth:N3-737
Why Visit Kemeitai at Electronica China?
As semiconductor components become smaller and more complex, packaging demands higher performance. At this year’s exhibition, we will highlight our core strengths in semiconductor protection:
Advanced Cover Tape Technology: Explore our range of Heat Activated Cover Tapes (HAA), engineered for stable peel force and excellent transparency.
Superior ESD Protection: Our tapes offer permanent and reliable anti-static performance, crucial for safeguarding sensitive ICs, passive components, and discrete devices.
Seamless SMT Compatibility: Designed with high tensile strength and consistent sealing, our cover tapes ensure zero jamming and smooth peel-back during high-speed SMT pick-and-place processes.
Meet Our Packaging Experts in Shanghai
Don’t miss the chance to discuss your specific packaging challenges with our technical team. Whether you need customized width specifications, specific peel-force tolerances, or cost-effective supply chain solutions, we have you covered.
Schedule a Meeting: Avoid the crowds by booking a dedicated time slot. Email us at [sales@kmtmaterial.com] or leave a message via our [Contact Us Page].
Explore More Online: Can’t wait for the show? Browse our [Cover Tape Product Catalog] ahead of time.
We look forward to connecting with global partners and driving the future of semiconductor packaging together. See you in Shanghai!